Electro Mechanical Engineer Stf

Standard Job Description

You will be the Electro Mechanical Engineer for the Advanced Electronics Packaging team at Lockheed Martin Missiles & Fire Control. Our team pioneers 2 D/3 D heterogeneous packaging concepts, integrating thin film, semiconductor and high performance thermal management technologies to create next generation electronic systems for aerospace and defense missions.

What You Will Be Doing
As the Electro Mechanical Engineer you will design, prototype and test cutting edge packaging solutions while collaborating with electrical, systems, test and product design engineers. You will work side by side with Lockheed Martin’s senior Advanced Packaging SME, gaining hands on experience with emerging semiconductor manufacturing processes and translating them into flight qualified hardware. Your responsibilities will include:

• Conceiving and modeling 2 D/3 D heterogeneous package architectures that meet size, weight, power and reliability targets.
• Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features.
• Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes.
• Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback.
• Preparing comprehensive design documentation, including drawings, BOMs, specifications and verification reports.
• Collaborating with cross functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems.
• Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance.
• Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption.
• Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts.

Why Join Us

Do you want to be part of a company culture that empowers employees to think big, lead with a growth mindset, and make the impossible a reality? We provide the resources and give you the flexibility to enable inspiration and focus. If you have the passion and courage to dream big, work hard, and have fun doing what you love then we want to build a better tomorrow with you.

We offer flexible work schedules to comprehensive benefits investing in your future and security. Learn more about Lockheed Martin’s comprehensive benefits package here.

Further Information About This Opportunity:

This position is in Orlando, FL or Grand Prairie,TX. Discover more about our Orlando, Florida location. Discover more about our Dallas, Texas location.

MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a secret clearance.

Basic Qualifications

-Minimum 8 years of professional experience in Electromechanical Engineering or related discipline with a Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university
or Minimum 12 years of professional experience in Electromechanical Engineering or related discipline without a degree
-Microelectronics & Layout Design: Proven experience in microelectronics design, including Circuit Card Assembly (CCA) / Printed Wiring Board (PWB/PCB) design, and flex circuit design.
-Interconnect Engineering: Experience with cable harness concepts for subsystem interfaces and generating detailed functional wiring diagrams.
-High-Speed Systems: Familiarity with high-speed applications and associated PWB layout constraints.
-Requirements Management: Experience capturing, flowing down, and deriving technical requirements for complex electromechanical designs.
-Component Selection: Experience managing parts, materials, and process selections for electronic hardware

Desired Skills

-Advanced Packaging Architecture: Experience with System-on-Chip (SOC) / Multi-Chip Package (MCP) solutions and 2D/3D heterogeneous integration concepts.
-Validation & Test Integration: Familiarity with Application-Specific Integrated Circuit (ASIC) verification and validation testing requirements at the circuit card level.
-Trade Studies & Optimization: Demonstrated ability to perform comprehensive design trade studies evaluating cost, weight, thermal packaging, and power benefits.
-Systems Engineering Tools: Familiarity with Model-Based Systems Engineering (MBSE) methodologies and CAMEO software