ElectroMechanical Packaging Engineer (Hardware Protection Focus)

Standard Job Description

You will be the Electro Mechanical Engineer for the Hardware Engineering team at Lockheed Martin Missiles and Fire Control (MFC). Our team delivers precision engagement aerospace and defense systems, designing, building and fielding the electrical hardware that powers missiles, sensors and other mission critical subsystems for the United States and allied militaries.

What You Will Be Doing

As the Electro Mechanical Engineer, you will have ownership of package hardware design, heat transfer and thermal dissipation, structural integrity and mechanical survivability of completed 3DHI packages throughout their operational lifespans. Your responsibilities will include

• Design multichip package devices, including package substrates, Integrated Heat Spreaders and attach mechanism, stiffeners, and complex thermal management system integration to manage high thermal dissipation requirements.
• Collaborate with mechanical and electrical engineering analysts to develop advanced Finite Element Analysis (FEA) to perform Multiphysics models and simulations for thermal cycling and reliability, power integrity and electrical performance, and mechanical stress including operation shock and vibration.
• Define and execute packaging qualification plans adhering to project requirements, JEDEC and MIL-SPEC standardizations (e.g., Highly Accelerated Stress Testing / HAST).
• Investigate and perform failure analysis loops on critical component interface and intermetallic connections including anomalies like cracked solder joints, delaminated layers, and warped package substrates. Implement corrective actions to mitigate identified failure modes in manufacturing and incorporate findings into product revisions while capturing lessons learned for future development activity.
• Architecting, designing, and validating advanced circuit card packages
• Designing high-density circuit cards, cable assemblies, and interconnect solutions that meet size, weight, power, security, and performance constraints
• Designing and developing electromechanical systems for advanced programs, special programs, and IRAD programs, including printed wiring boards, circuit/electronic card assemblies, harness assemblies, and sub-assemblies
• Leading and documenting design assurance reviews, tracking issues, and driving corrective actions to closure
• Performing thermal, signal integrity, and electromagnetic compatibility analyses to ensure robust operation in harsh DoD environments
• Coordinating with cross-functional teams — systems, hardware, software, test, and supply chain — to deliver high-quality results on schedule and within budget
• Managing risk, schedule, and earned value metrics, and reporting status to senior leadership

Why Join Us

Do you want to be part of a company culture that empowers employees to think big, lead with a growth mindset, and make the impossible a reality? We provide the resources and give you the flexibility to enable inspiration and focus. If you have the passion and courage to dream big, work hard, and have fun doing what you love then we want to build a better tomorrow with you.

We offer flexible work schedules to comprehensive benefits investing in your future and security. Learn more about Lockheed Martin’s comprehensive benefits package here.

Further Information About This Opportunity:

This position is in Orlando, FL. Discover more about our Orlando, Florida location.

MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a secret clearance.

Basic Qualifications

• Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university; Master’s degree or PhD preferred or Minimum 15 years of professional experience in Electromechanical Engineering or related discipline without a degree
• 3D Heterogeneous Integration (3DHI)
• Advanced Packaging
• Technical or project leadership experience supporting the production of high-reliability electronics products
• Microelectronics design
• Proficient in CREO modeling and electromechanical system design
• Project leadership/management experience throughout the engineering/production lifecycle: scoping, sizing, cost estimation, planning, scheduling, staffing, tracking, and earned value management (EVM)
• Experience in presentation, oral and written communication to facilitate effective and efficient interchanges between co-workers, leaders, and customers
• Experience working with cross-functional teams across multiple locations
• Experience capturing flowed and derived requirements for electromechanical designs
• Must be a US Citizen; must possess or be able to obtain a DoD Secret security clearance

Desired Skills

• Thermal Interface Materials (TIM1/TIM2)
• Lid Attach
• Package Stiffener Rings
• JEDEC Qualification
• HAST
• Thermo-mechanical Stress
• Multiphysics modeling
• Direct experience supporting production (manufacturing and test)
• Demonstrated leadership skills and behaviors that align with Full Spectrum Leadership Imperatives
• Preparation for and participation in major program design reviews (PDR, CDR)
• Experience troubleshooting and resolving technical issues
• Proven understanding of electronics standards and processes
• Proven understanding of mechanical standards and processes
• Proven understanding of electronic packaging principles
• Demonstrated ability to multitask and adapt to changing priorities
• Experience with military defense hardware
• Experience with parts and materials selections
• Ability to perform design trade studies evaluating cost, weight, packaging, and power benefits
• Flex circuit and microelectronics design experience
• Active DoD Secret or Top Secret Clearance